The role of reactive woodworking rubber filler
Adhesive tends to shrink in volume during the curing process, which is caused by chemical reaction. In addition, when the temperature changes, the rubber layer and the adherend formed by the curing of the wood glue adhesive will cause thermal shrinkage stress due to different thermal expansion coefficients. Both kinds of shrinkage will cause internal stress in the rubber layer, causing stress concentration, which will cause cracking of the rubber layer and damage of the adhesive bond head, affecting the service life of the bonded joint. The surface of the titanium dioxide and kaolin after the mixed high temperature calcination The internal structure has changed greatly, has higher activity, and is well integrated with the adhesive, which can reduce the difference of thermal expansion coefficient between the adhesive layer and the bonded object, thereby reducing thermal stress, improving bonding strength and adhesive layer. Impact toughness and high temperature resistance.
Wood glue
(1) In this test, the phenolic modification of ethylenediamine with phenol:aldehyde:amine=5:4:3 was carried out to obtain better modified products.
(2) The test results show that the adhesive strength and temperature resistance of the flexible epoxy resin adhesive with HTBN:E-44:SiR=40:100:30 formula are better.
(3) The best formula of the adhesive is: the dosage of phenolic modified ethylenediamine is 110% of flexible epoxy resin, the lacquer adhesive diluent is 5% 10%, and the active filler is 5% 10%.
(4) The adhesive can be used at room temperature or at a high temperature of 100 ° C and 150 ° C.
Shanghai Zhenniu Chemical Co., Ltd.